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[IEEE 2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Suzhou, Jiangsu, China (2009.07.6-2009.07.10)] 2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits - Comparison of breakdown mechanism of HfO2 and HfSiOx high-k gate dielectrics with N2 RTA treatment on TDDB constant voltage stress
Lin, Cheng-Li, Mei-Yuan Chou,, Hong, Jia-Jun, Kang, Tsung-Kuei, Shich-Chuan Wu,, Pi-Chun Juan,Year:
2009
Language:
english
DOI:
10.1109/ipfa.2009.5232675
File:
PDF, 9.32 MB
english, 2009