Interface microstructure evolution of lead-free solder on...

IEEE Transactions on Device and Materials Reliability 2005 / 06 Vol. 5; Iss. 2

Interface microstructure evolution of lead-free solder on Ni-based under bump metallizations during reflow and high temperature storage

Chih Hang Tung,, Poi Siong Teo,, Lee, C.
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Volume:
5
Language:
english
Journal:
IEEE Transactions on Device and Materials Reliability
DOI:
10.1109/tdmr.2005.846978
Date:
June, 2005
File:
PDF, 2.30 MB
english, 2005
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