Enhancement of Via Integrity in High-Tg Multilayer Printed...

IEEE Transactions on Components Packaging and Manufacturing Technology 2013 / 05 Vol. 3; Iss. 5

Enhancement of Via Integrity in High-Tg Multilayer Printed Wiring Boards

Bhat, S. N., Singh, A. P., Prasad, G. N. V., Suresh, A.
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Volume:
3
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/tcpmt.2013.2243204
Date:
May, 2013
File:
PDF, 4.50 MB
english, 2013
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