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[IEEE International Electron Devices Meeting. Technical Digest - Washington, DC, USA (2-5 Dec. 2001)] International Electron Devices Meeting. Technical Digest (Cat. No.01CH37224) - Newly developed electro-chemical polishing process of copper as replacement of CMP suitable for damascene copper inlaid in fragile low-k dielectrics
Sato, S., Yasuda, Z., Ishihara, M., Komai, N., Ohtorii, H., Yoshio, A., Segawa, Y., Horikoshi, H., Ohoka, Y., Tai, K., Takahashi, S., Nogami, T.Year:
2001
Language:
english
DOI:
10.1109/iedm.2001.979413
File:
PDF, 382 KB
english, 2001