[IEEE 2008 IEEE 9th VLSI Packaging Workshop of Japan -...

  • Main
  • [IEEE 2008 IEEE 9th VLSI Packaging...

[IEEE 2008 IEEE 9th VLSI Packaging Workshop of Japan - Kyoto, Japan (2008.12.1-2008.12.2)] 2008 IEEE 9th VLSI Packaging Workshop of Japan - Board level reliability of novel Fan-in package on package(PoP)

Young-Lyong Kim,, Cheul-Joong Youn,, Jong-Ho Lee,, Hyung-Kil Baek,, Eun-Chul Ahn,, Young-Hee Song,, Tae-Gyeong Chung,
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Year:
2008
Language:
english
DOI:
10.1109/vpwj.2008.4762205
File:
PDF, 4.12 MB
english, 2008
Conversion to is in progress
Conversion to is failed