![](/img/cover-not-exists.png)
[IEEE 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2012.05.29-2012.06.1)] 2012 IEEE 62nd Electronic Components and Technology Conference - 3D multi-stacking of thin dies based on TSV and micro-inserts interconnections
Souriau, Jean-Charles, Castagne, Laetitia, Liotard, Jean-Luc, Inal, Karim, Mazuir, Jessica, Le Texier, Francois, Fresquet, Gilles, Varvara, Maxime, Launay, Nicolas, Dubois, Beatrice, Malia, ThierryYear:
2012
Language:
english
DOI:
10.1109/ectc.2012.6248965
File:
PDF, 1.70 MB
english, 2012