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[IEEE 2014 International Conference on Electronics Packaging (ICEP) - Toyama, Japan (2014.4.23-2014.4.25)] 2014 International Conference on Electronics Packaging (ICEP) - Calculation of tempearture distribution of power Si MOSFET with electro-thermal analysis The effect of boundary condition
Kibushi, Risako, Hatakeyama, Tomoyuki, Nakagawa, Shinji, Ishizuka, MasaruYear:
2014
Language:
english
DOI:
10.1109/icep.2014.6826743
File:
PDF, 2.80 MB
english, 2014