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Electroless copper plating using FeII as a reducing agent
Michinari Sone, Koichi Kobayakawa, Makoto Saitou, Yuichi SatoVolume:
49
Year:
2004
Language:
english
Pages:
6
DOI:
10.1016/j.electacta.2003.07.004
File:
PDF, 456 KB
english, 2004