[IEEE 2010 International Power Electronics Conference (IPEC - Sapporo) - Sapporo, Japan (2010.06.21-2010.06.24)] The 2010 International Power Electronics Conference - ECCE ASIA - - Thermal analysis for hybrid pair module of Si-IEGT and SiC-PiN diode
Wada, Keiji, Koyama, Jumpei, Takao, Kazuto, Kanai, Takeo, Oohashi, HiromichiYear:
2010
Language:
english
DOI:
10.1109/ipec.2010.5543639
File:
PDF, 1.03 MB
english, 2010