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[IEEE 16th IEEE/CPMT International Electronic Manufacturing Technology Symposium - La Jolla, CA, USA (12-14 Sept. 1994)] Proceedings of 16th IEEE/CPMT International Electronic Manufacturing Technology Symposium - Electroless Ni/Au bumps for flipchip-on-flex and TAB applications
Aintila, A., Bjorklof, A., Jarvinen, E., Lalu, S.Year:
1994
Language:
english
DOI:
10.1109/iemt.1994.404673
File:
PDF, 748 KB
english, 1994