[IEEE 2006 International Electron Devices Meeting - San Francisco, CA, USA (2006.12.11-2006.12.13)] 2006 International Electron Devices Meeting - Direct Silicon Bonded (DSB) Substrate Solid Phase Epitaxy (SPE) Integration Scheme Study for High Performance Bulk CMOS
Yin, Haizhou, Sung, C. Y., Ng, H., Saenger, K.L., Chan, V., Crowder, S., Zhang, R., Li, J., Ott, J. A., Pfeiffer, G., Bendernagel, R., Ko, S.B., Ren, Z., Chen, X., Wang, G., Liu, J., Cheng, K., MesfinYear:
2006
Language:
english
DOI:
10.1109/iedm.2006.346962
File:
PDF, 634 KB
english, 2006