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Influence of the interaction between chloride and thiourea on copper electrodeposition
Nisit Tantavichet, Somsak Damronglerd, Orawan ChailapakulVolume:
55
Year:
2009
Language:
english
Pages:
10
DOI:
10.1016/j.electacta.2009.08.045
File:
PDF, 2.60 MB
english, 2009