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[IEEE 2014 15th International Conference on Electronic Packaging Technology (ICEPT) - Chengdu, China (2014.8.12-2014.8.15)] 2014 15th International Conference on Electronic Packaging Technology - Improvement of manufacturing process for multilayer substrate integrated waveguide cavity
Xu, Ziqiang, Zhang, Gen, Cao, Guangliang, Cheng, GeshengYear:
2014
Language:
english
DOI:
10.1109/icept.2014.6922919
File:
PDF, 346 KB
english, 2014