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[IEEE 2012 IEEE International Electron Devices Meeting (IEDM) - San Francisco, CA, USA (2012.12.10-2012.12.13)] 2012 International Electron Devices Meeting - 3D Ferroelectric-like NVM/CMOS hybrid chip by sub-400 °C sequential layered integration
Lien, Yu-Chung, Shieh, Jia-Min, Huang, Wen-Hsien, Hsieh, Wei-Shang, Tu, Cheng-Hui, Wang, Chieh, Shen, Chang-Hong, Chou, Tung-Huan, Chen, Min-Cheng, Huang, Jung Y., Pan, Ci-Ling, Lai, Yin-Chieh, Hu, ChYear:
2012
Language:
english
DOI:
10.1109/iedm.2012.6479160
File:
PDF, 2.06 MB
english, 2012