[IEEE 2014 IEEE 26th International Symposium on Power Semiconductor Devices & IC's (ISPSD) - Waikoloa, HI, USA (2014.6.15-2014.6.19)] 2014 IEEE 26th International Symposium on Power Semiconductor Devices & IC's (ISPSD) - TCAD modeling of charge transport in HV-IC encapsulation materials
Imperiale, I., Reggiani, S., Gnani, E., Gnudi, A., Baccarani, G., Nguyen, L., Denison, M.Year:
2014
Language:
english
DOI:
10.1109/ispsd.2014.6856073
File:
PDF, 1.02 MB
english, 2014