New simultaneous switching noise analysis and modeling for high-speed and high-density CMOS IC package design
Yungseon Eo,, Eisenstadt, W.R., Ju Young Jeong,, Oh-Kyong Kwon,Volume:
23
Language:
english
Journal:
IEEE Transactions on Advanced Packaging
DOI:
10.1109/6040.846649
Date:
May, 2000
File:
PDF, 220 KB
english, 2000