[IEEE 2011 Materials for Advanced Metallization (MAM) - Dresden, Germany (2011.05.8-2011.05.12)] 2011 IEEE International Interconnect Technology Conference - High-performance metal hard mask process using novel TiN film for 32-nm node Cu interconnect and beyond
Torazawa, Naoki, Hinomura, Toru, Harada, Takeshi, Kabe, Tatsuya, Inagaki, Daisuke, Morinaga, Yasunori, Shibata, Junichi, Shigetoshi, Takushi, Hazue, Shunsuke, Motojima, Dai, Matsumoto, Susumu, KishidaYear:
2011
Language:
english
DOI:
10.1109/iitc.2011.5940342
File:
PDF, 1.35 MB
english, 2011