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[IEEE 2008 58th Electronic Components and Technology Conference (ECTC 2008) - Lake Buena Vista, FL, USA (2008.05.27-2008.05.30)] 2008 58th Electronic Components and Technology Conference - Ultra-small compact transfer molded package for power modules
Sano, Ko, Hayashi, Kenichi, Kawafuji, Hisashi, Funakoshi, NobuhitoYear:
2008
Language:
english
DOI:
10.1109/ectc.2008.4550230
File:
PDF, 580 KB
english, 2008