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[IEEE Proceedings of the IEEE 2006 International Interconnect Technology Conference - Burlingame, CA (2006.06.5-2006.06.7)] 2006 International Interconnect Technology Conference - Physical, Electrical, and Reliability Characterization of Ru for Cu Interconnects

Yang, C.-C., Spooner, T., Ponoth, S., Chanda, K., Simon, A., Lavoie, C., Lane, M., Hu, C.-K., Liniger, E., Gignac, L., Shaw, T., Cohen, S., McFeely, F., Edelstein, D.
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Year:
2006
Language:
english
DOI:
10.1109/iitc.2006.1648684
File:
PDF, 684 KB
english, 2006
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