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[IEEE 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007 - London, UK (2007.04.16-2007.04.18)] 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007 - Prognostics and Health Monitoring of Electronics
Pecht, Michael, Tuchband, Brian, Vichare, Nikhil, Ying, Qu JianYear:
2007
Language:
english
DOI:
10.1109/esime.2007.360069
File:
PDF, 271 KB
english, 2007