[IEEE 2007 International Conference on Thermal, Mechanical...

  • Main
  • [IEEE 2007 International Conference on...

[IEEE 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007 - London, UK (2007.04.16-2007.04.18)] 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007 - Prognostics and Health Monitoring of Electronics

Pecht, Michael, Tuchband, Brian, Vichare, Nikhil, Ying, Qu Jian
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Year:
2007
Language:
english
DOI:
10.1109/esime.2007.360069
File:
PDF, 271 KB
english, 2007
Conversion to is in progress
Conversion to is failed