[IEEE 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2013.05.28-2013.05.31)] 2013 IEEE 63rd Electronic Components and Technology Conference - Effective package-on-package warpage DOE design with analytical method
Wen, Shengmin, Lin, WeiYear:
2013
Language:
english
DOI:
10.1109/ectc.2013.6575667
File:
PDF, 853 KB
english, 2013