[IEEE 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2014.5.27-2014.5.30)] 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - A novel 3D packaging concept for RF powered sensor grains
Pachler, Walther, Pressel, Klaus, Grosinger, Jasmin, Beer, Gottfried, Bosch, Wolfgang, Holweg, Gerald, Zilch, Christian, Meindl, ManfredYear:
2014
Language:
english
DOI:
10.1109/ectc.2014.6897440
File:
PDF, 2.80 MB
english, 2014