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[IEEE 2014 International Conference on Electronics Packaging (ICEP) - Toyama, Japan (2014.4.23-2014.4.25)] 2014 International Conference on Electronics Packaging (ICEP) - Multilayered Sn/Ag3Sn electroplating on Cu alloys for high reliable electronic/electric materials
Kure-Chu, Song-Zhu, Ogasawara, Tohru, Yashiro, Hitoshi, Rongbin Ye,, Hhosokai, Takuya, Uchidate, Michimasa, Suziki, Eiichi, Naito, TomoyukiYear:
2014
Language:
english
DOI:
10.1109/icep.2014.6826683
File:
PDF, 1.82 MB
english, 2014