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[IEEE 2008 58th Electronic Components and Technology Conference (ECTC 2008) - Lake Buena Vista, FL, USA (2008.05.27-2008.05.30)] 2008 58th Electronic Components and Technology Conference - Mechanical reliability modeling and characterization for Package-on-Package
Masazumi Amagai,, Yutaka Suzuki,, Kenji Abe,, YoungBae Kim,, Hitoyuki Sano,Year:
2008
Language:
english
DOI:
10.1109/ectc.2008.4550167
File:
PDF, 1.11 MB
english, 2008