[IEEE 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009) - San Diego, CA, USA (2009.05.26-2009.05.29)] 2009 59th Electronic Components and Technology Conference - Underfill delamination to chip sidewall in advanced flip chip packages
Paquet, Marie-Claude, Sylvestre, Julien, Gros, Emmanuelle, Boyer, NicolasYear:
2009
Language:
english
DOI:
10.1109/ectc.2009.5074129
File:
PDF, 644 KB
english, 2009