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[IEEE 2007 Asia Optical Fiber Communication and Optoelectronics Conference - Shanghai, China (2007.10.17-2007.10.19)] 2007 Asia Optical Fiber Communication and Optoelectronics Conference - Mutual thermal effects of light-emitting diode with wafer-level packages
Jae-Wan Choi,, Jeong-Mo Kang,, Jae-Wook Kim,, Jeong-Hyeon Choi,, Du-Hyun Kim,, Geun-Ho Kim,, Jeong-Soo Lee,Year:
2007
Language:
english
DOI:
10.1109/aoe.2007.4410806
File:
PDF, 770 KB
english, 2007