[IEEE 2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Suzhou, Jiangsu, China (2009.07.6-2009.07.10)] 2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits - Study on PoP (package-on-package) Assembly Technology
Yang, Hong Zhen, Li, Guo Hong, Cao, Xin YuYear:
2009
Language:
english
DOI:
10.1109/ipfa.2009.5232653
File:
PDF, 4.90 MB
english, 2009