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[IEEE International Conference on Multichip Modules - Denver, CO (April 13-15, 1994)] Proceedings of the International Conference on Multichip Modules - AT&T spl mu/Surface Mount Assembly: A New Technology for the Large Volume Fabrication of Cost Effective Flip-Chip MCMs
Dudderar, T.D., Degani, Y., Spadafora, J.G., Tai, K.L., Frye, R.C.Year:
1994
Language:
english
DOI:
10.1109/icmcm.1994.753561
File:
PDF, 918 KB
english, 1994