[IEEE 2006 International Conference on Simulation of Semiconductor Processes and Devices - Monterey, CA, USA (2006.09.6-2006.09.8)] 2006 International Conference on Simulation of Semiconductor Processes and Devices - Three-Dimensional Simulation of Intrinsic Stress Build-Up in Thin Films
Ceric, H., Hollauer, C., Selberherr, S.Year:
2006
Language:
english
DOI:
10.1109/sispad.2006.282869
File:
PDF, 4.16 MB
english, 2006