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[IEEE 2006 8th International Conference on Solid-State and Integrated Circuit Technology Proceedings - Shanghai, China (2006.10.23-2006.10.26)] 2006 8th International Conference on Solid-State and Integrated Circuit Technology Proceedings - Electrical conduction and reliability of anisotropic conductive adhesives filled with Ag/Cu-coated epoxy composite particles
Zhihong, Lei, Ying, He, Licong, GaoYear:
2006
Language:
english
DOI:
10.1109/icsict.2006.306653
File:
PDF, 77 KB
english, 2006