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[IEEE 2012 IEEE 14th Electronics Packaging Technology Conference - (EPTC 2012) - Singapore (2012.12.5-2012.12.7)] 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) - Fine-pitch, low-volume SoP(Solder-on-Pad) process
Ho-Eun Bae,, Kwang-Seong Choi,, Hyun-Cheol Bae,, Yong-Sung Eom,, Dong-sik Bae,Year:
2012
Language:
english
DOI:
10.1109/eptc.2012.6507177
File:
PDF, 530 KB
english, 2012