[IEEE 2014 15th International Conference on Electronic Packaging Technology (ICEPT) - Chengdu, China (2014.8.12-2014.8.15)] 2014 15th International Conference on Electronic Packaging Technology - Research of surface wettability of plating on the ceramic shell
Li, Dongmei, Feng, Xiaocheng, He, Jinchun, Lian, Binhao, Wang, YongYear:
2014
Language:
english
DOI:
10.1109/icept.2014.6922860
File:
PDF, 378 KB
english, 2014