[IEEE 2008 15th International Symposium on the Physical and...

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[IEEE 2008 15th International Symposium on the Physical and Failure Analysis of Integrated Circuits - singapore (2008.07.7-2008.07.11)] 2008 15th International Symposium on the Physical and Failure Analysis of Integrated Circuits - Etching of copper in deionized water rinse

Gambino, J., Robbins, J., Rutkowski, T., Johnson, C., DeVries, K., Rath, D., Vereecken, P., Walton, E., Porth, B., Wenner, M, McDevitt, T., Chapple-Sokol, J., Luce, S.
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Year:
2008
Language:
english
DOI:
10.1109/ipfa.2008.4588209
File:
PDF, 1.25 MB
english, 2008
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