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[IEEE 2007 9th Electronics Packaging Technology Conference - Singapore (2007.12.10-2007.12.12)] 2007 9th Electronics Packaging Technology Conference - Fine Pitch Au-SnAgCu Joint-in-via Flip-Chip Packaging

Lee, Teck Kheng, Zhang, Sam, Wong, C.C., Tan, A.C.
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Year:
2007
Language:
english
DOI:
10.1109/eptc.2007.4469722
File:
PDF, 518 KB
english, 2007
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