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[IEEE 2011 IEEE International Ultrasonics Symposium (IUS) - Orlando, FL, USA (2011.10.18-2011.10.21)] 2011 IEEE International Ultrasonics Symposium - Acoustic inspection of high-density-interconnects for 3D-integration
Brand, Sebastian, Petzold, Matthias, Czurratis, Peter, Reed, Jason D., Lueck, Matthew, Gregory, Chris, Huffman, Alan, Lennon, John M., Temple, Dorota S.Year:
2011
Language:
english
DOI:
10.1109/ultsym.2011.0264
File:
PDF, 2.11 MB
english, 2011