[IEEE 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2014.5.27-2014.5.30)] 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Large low-CTE glass package-to-PCB interconnections with solder strain-relief using polymer collars
Menezes, Gary, Smet, Vanessa, Kobayashi, Makoto, Sundaram, Venky, Raj, Pulugurtha Markondeya, Tummala, RaoYear:
2014
Language:
english
DOI:
10.1109/ectc.2014.6897571
File:
PDF, 2.14 MB
english, 2014