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[IEEE Sixth International Symposium on Quality of Electronic Design (ISQED'05) - San Jose, CA, USA (21-23 March 2005)] Sixth International Symposium on Quality of Electronic Design (ISQED'05) - Dummy Filling Methods for Reducing Interconnect Capacitance and Number of Fills
Kurokawa, A., Kanamoto, T., Ibe, T., Kasebe, A., Chang Wei Fong,, Kage, T., Inoue, Y., Masuda, H.Year:
2005
Language:
english
DOI:
10.1109/isqed.2005.47
File:
PDF, 218 KB
english, 2005