Influence of process parameter variations on the signal...

IEEE Transactions on Components Packaging and Manufacturing Technology Part B 1995 / Aug. Vol. 18; Iss. 3

Influence of process parameter variations on the signal distribution behavior of wafer scale integration devices

Gneiting, T., Jalowiecki, I.P.
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
18
Language:
english
Journal:
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B
DOI:
10.1109/96.404098
Date:
January, 1995
File:
PDF, 668 KB
english, 1995
Conversion to is in progress
Conversion to is failed