[IEEE 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Tokyo, Japan (2012.05.22-2012.05.23)] 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration - Low-temperature wafer bonding using sub-micron gold particles for wafer-level MEMS packaging
Ishida, H., Ogashiwa, T., Kanehira, Y., Ito, S., Yazaki, T., Mizuno, J.Year:
2012
Language:
english
DOI:
10.1109/ltb-3d.2012.6238083
File:
PDF, 775 KB
english, 2012