[IEEE 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2011.10.19-2011.10.21)] 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Reliable microjoints for chip stacking formed by solid-liquid interdiffusion (SLID) bonding
Chang, Tao-Chih, Cheng, Ren-Shin, Kao, Kuo-Shu, Li, Wei, Lee, Ching-Kuan, Chang, Jing-Yao, Huang, Shin-Yi, Fan, Chia-Wen, Hung, Yin-Po, Huang, Yu-Wei, Lin, Yu-Min, Chen, Tai-Hong, Leu, Fang-Jun, Fun,Year:
2011
Language:
english
DOI:
10.1109/impact.2011.6117243
File:
PDF, 5.97 MB
english, 2011