[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2008.07.28-2008.07.31)] 2008 International Conference on Electronic Packaging Technology & High Density Packaging - Effect of moisture and temperature on Al-Cu interfacial strength
Hui Teng,, Huiliang Zhang,, Hongbo Yang,, Ming Zhou,, Tsui, Anthony C.Year:
2008
Language:
english
DOI:
10.1109/icept.2008.4607077
File:
PDF, 305 KB
english, 2008