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[IEEE 2014 IEEE Conference on Electrical Insulation and Dielectric Phenomena - (CEIDP 2014) - Des Moines, IA, USA (2014.10.19-2014.10.22)] 2014 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP) - Effects of filler distribution on morphology and thermal conductivity of polymer composites
Vanga-Bouanga, C., Savoie, S., Frechette, M.F., David, E.Year:
2014
Language:
english
DOI:
10.1109/ceidp.2014.6995910
File:
PDF, 2.83 MB
english, 2014