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[IEEE Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2008.10.22-2008.10.24)] 2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference - 3D Integration : a technological toolbox
Poupon, Gilles, Scannell, Mark, di Cioccio, Lea, Henry, David, Leduc, Patrick, Clavelier, Laurent, Sillon, NicolasYear:
2008
Language:
english
DOI:
10.1109/impact.2008.4783890
File:
PDF, 3.65 MB
english, 2008