Curing Behavior of Wood Adhesives Under High Steam Pressure

The Journal of Adhesion 1996 / 08 Vol. 59; Iss. 1-4

Curing Behavior of Wood Adhesives Under High Steam Pressure

Umemura, Kenji, Kawai, Shuichi, Sasaki, Hikaru, Hamada, Ryozo, Mizuno, Yasusi
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Volume:
59
Language:
english
Journal:
The Journal of Adhesion
DOI:
10.1080/00218469608011079
Date:
August, 1996
File:
PDF, 771 KB
english, 1996
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