[IEEE 2014 International Conference on Electronics Packaging (ICEP) - Toyama, Japan (2014.4.23-2014.4.25)] 2014 International Conference on Electronics Packaging (ICEP) - Impact properties of Sn-3Ag-0.5Cu solder ball joint with epoxy-based flux
Ishiyama, Akiyoshi, Shohji, Ikuo, Ganbe, Tatsuya, Watanabe, HirohikoYear:
2014
Language:
english
DOI:
10.1109/icep.2014.6826784
File:
PDF, 1.86 MB
english, 2014