Wafer-Level Integration Technique of Surface Mount Devices...

IEEE Transactions on Components and Packaging Technologies 2007 / 09 Vol. 30; Iss. 3

Wafer-Level Integration Technique of Surface Mount Devices on a Si-Wafer With Vibration Energy and Gravity Force

Sudou, Minoru, Takao, Hidekuni, Sawada, Kazuaki, Ishida, Makoto
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Volume:
30
Language:
english
Journal:
IEEE Transactions on Components and Packaging Technologies
DOI:
10.1109/tcapt.2007.898742
Date:
September, 2007
File:
PDF, 2.48 MB
english, 2007
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