[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2008.07.28-2008.07.31)] 2008 International Conference on Electronic Packaging Technology & High Density Packaging - Investigation of electromigration in copper interconnection of ULSI
Dechun Lu,, Shengxiang Bao,, Lili Ma,, Zhibo Du,Year:
2008
Language:
english
DOI:
10.1109/icept.2008.4607154
File:
PDF, 228 KB
english, 2008