[IEEE Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Bordeaux, France (2010.04.26-2010.04.28)] 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) - Development of fast and easy methods for measuring the Young's modulus of molding compounds for IC packages
Ivankovic, Andrej, Vanstreels, Kris, Vanderstraeten, Daniel, Brizar, Guy, Gillon, Renaud, Blansaer, Eddy, Vandevelde, BartYear:
2010
Language:
english
DOI:
10.1109/esime.2010.5464535
File:
PDF, 1.04 MB
english, 2010