[IEEE 2014 International Conference on Electronics...

  • Main
  • [IEEE 2014 International Conference on...

[IEEE 2014 International Conference on Electronics Packaging (ICEP) - Toyama, Japan (2014.4.23-2014.4.25)] 2014 International Conference on Electronics Packaging (ICEP) - Effect of filler morphology on fatigue properties of stretchable wires printed with Ag pastes

Itabashi, Yosuke, Inoue, Masahiro, Tada, Yasunori
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Year:
2014
Language:
english
DOI:
10.1109/icep.2014.6826782
File:
PDF, 1.25 MB
english, 2014
Conversion to is in progress
Conversion to is failed