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[IEEE 2012 4th Electronic System-Integration Technology Conference (ESTC) - Amsterdam, Netherlands (2012.09.17-2012.09.20)] 2012 4th Electronic System-Integration Technology Conference - 3D SiP module using TSV and novel low-volume solder-on-pad(SoP) process
Bae, Hyun-Cheol, Bae, Ho-Eun, Jeon, Su-Jeong, Jung, Kwang-Hoon, Eom, Yong-Sung, Choi, Kwang-SeongYear:
2012
Language:
english
DOI:
10.1109/estc.2012.6542209
File:
PDF, 2.92 MB
english, 2012